| - | High adhesive strength with Copper, Stainless Steel, Polyimide Film, glass Reinforced Epoxy Sheet, etc. |
| - | Excellent reliability against the Thermal Cycle Test (TCT) and the Reflow Soldering process. |
| - | High insulation resistance. |
| - | Short curing time and easy processing. |
TYPICAL APPLICATIONS
| Suitable for interlayer adhesion, especially for IC packaging. |
| Stiffener for Tape-BGA, Heat Spreader, Interposer for Tape-BGA or Chip Scale Package (CSP), Adhesive for interlayer. |
SPECIFICATION
| Configuration | Cover film (PET: 38 µm)/Adhesive (10 to 100 µm available) / Cover film (PET: 38 µm) |
| Size | Maximum width: 490 mm, standard length: 200 m |
