| - | Photosensitive Polyimide coatings used for interlayer dielectric and passivation layers for semiconductors, ICs, LSIs, MCM, etc. | |
| - | Polymide fine patterns can be formed simply through exposure, development and curing. |
FEATURES
| Outstanding heat resistance. |
After curing, PHOTONEECE® maintains its
high heat resistance without degradation, although it
has photosensitive properties. |
| Excellent mechanical properties. |
Tough, smooth films can be formed without degradation,
although it has photosensitive properties. |
| Superior electrical properties. |
PHOTONEECE® demonstrates superior electrical
insulating and dielectric properties. |
| Easy processability. |
PHOTONEECE® forms fine aromatic polyimide
patterns without the need for photoresists. |
| Low metallic ion content. |
Metallic ion content, which can have adverse effects
on semiconductor characteristics, is kept to minimum. |
| Good adhension. |
PHOTONEECE® adheres especially well to
silicon wafers ceramics and glass substrates, metals and
epoxy molding compounds. |
TYPICAL APPLICATIONS
| - | Protective films and stress buffer coatings for semiconductor devices. |
| - | Alpha-particle protective coatings for memory devices. |
| - | Interlayer dielectric for high-density multilayercircuits. |
| - | Interlayer dielectric for multichip modules. |
| - | Protective films for microelectronic devices. |
Electron Beam resists "EBR" Series
| - | Positive-type electron beam resists for the submicron level fabrication of VLSIs. |
| - | Excellent resolution and patterns of 0.2 µm can be formed. |
| - | Wide process latitude enables highly accurate photomask making. |  Yuri Okazaki Toray Marketing and Sales (America), Inc. 411 Borel Ave. Suite 520 San Mateo, CA 94402 Tel: (650) 524-2731 Fax: (650) 341-0845 E-mail: yuri.o@toray-tomac.com |
