| - | Polyimide coatings used for interlayer dielectric and
passivation layers for semiconductors, ICs, LSIs, electronic parts,
etc. and alignment layers for LCDs. |
| - | Polyimide fine patterns can be formed with photoresists. |
FEATURES
| High temperature resistance. |
Applicable at temperatures up to 200°C (normal use)
and 400°C (short duration). |
| Electrical properties. |
Superb electrical insulation and dielectric
properties. |
| Simple pattern making. |
Simple making of fine aromatic polyimide patterns using
photoresists. |
| Low metallic ion content. |
Metallic ion content, capable of adversely affecting
semiconductor device characteristics, is kept at a minimal level |
| Good adhension. |
Excellent adhension to silicon wafers, ceramic and
glass substrates, as well as various metals. It also boasts and excellent
adhension to LSI encapsulating resin, thus improving the reliability
of devices. |
TYPICAL APPLICATIONS
| * | Passivation of and buffer coatings for semiconductor devices. |
| * | Multi-layer insulation films for semiconductor devices |
| * | Alpha-particle protection coatings |
| * | Alignment layer for liquid crystal display |
| * | Protection layers and multi-layer insulation films for microelectronic circuits |
| * | Lift-off masks |
 Yuri Okazaki Toray Marketing and Sales (America), Inc. 411 Borel Ave. Suite 520 San Mateo, CA 94402 Tel: (650) 524-2731 Fax: (650) 341-0845 E-mail: yuri.o@toray-tomac.com |
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